Electrically conductive adhesive bondlines
A Standard patent application filed on 24 January 1996 credited to Schlup, John R

Details

Application number :

52952  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Electrically conductive adhesive bondlines  

Inventor :

Schlup, John R  

Agent name :

 

Address for service :

 

Filing date :

24 January 1996  

Associated companies :

 

Applicant name :

Kansas State University Research Foundation  

Applicant address :

 

Old name :

 

Original Source :

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