Method of manufacturing an interlayer via and a laminate precursor useful for same
A Standard patent application filed on 05 November 1999 credited to Petti, Michael ; Smith, Gordon C.

Details

Application number :

14709  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of manufacturing an interlayer via and a laminate precursor useful for same  

Inventor :

Petti, Michael ; Smith, Gordon C.  

Agent name :

 

Address for service :

 

Filing date :

05 November 1999  

Associated companies :

 

Applicant name :

Allied-Signal Inc.  

Applicant address :

 

Old name :

 

Original Source :

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