A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink
A Standard patent application filed on 21 December 1995 credited to Miettinen, Erkki

Details

Application number :
42630  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink  
Inventor :
Miettinen, Erkki  
Agent name :
 
Address for service :
 
Filing date :
21 December 1995  
Associated companies :
 
Applicant name :
ABB Industry Oy  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor