Cavity filled metal electronic package
A Standard patent application filed on 20 March 1995 credited to Parthasarathi, Arvind ; Hoffman, Paul R. ; Pasqualoni, Anthony M ; Mahulikar, Deepak ; Liang, Dexin

Details

Application number :

21038  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Cavity filled metal electronic package  

Inventor :

Parthasarathi, Arvind ; Hoffman, Paul R. ; Pasqualoni, Anthony M ; Mahulikar, Deepak ; Liang, Dexin  

Agent name :

 

Address for service :

 

Filing date :

20 March 1995  

Associated companies :

 

Applicant name :

Olin Corporation  

Applicant address :

 

Old name :

 

Original Source :

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