Flip chip having integral mask and underfill providing two-stage bump formation
A Standard patent application filed on 14 September 2000 credited to Blumel, David ; Gilleo, Kenneth Burton

Details

Application number :
74847  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Flip chip having integral mask and underfill providing two-stage bump formation  
Inventor :
Blumel, David ; Gilleo, Kenneth Burton  
Agent name :
 
Address for service :
 
Filing date :
14 September 2000  
Associated companies :
 
Applicant name :
Alpha Metals, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor