Novel chip interconnect and packaging deposition methods and structures
A Standard patent application filed on 13 September 2000 credited to Uzoh, Cypria Emeka ; Basol, Bulent ; Talieh, Homayoun

Details

Application number :

74841  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Novel chip interconnect and packaging deposition methods and structures  

Inventor :

Uzoh, Cypria Emeka ; Basol, Bulent ; Talieh, Homayoun  

Agent name :

 

Address for service :

 

Filing date :

13 September 2000  

Associated companies :

 

Applicant name :

Nutool, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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