Hot-melt adhesive compositions crosslinkable by moisture
A Standard patent application filed on 02 December 1993 credited to Chenard, Jean-Yves
;
Jammet, Jean-Claude
;
Dupic, Jean-Pierre
Details
Application number :
52124
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Hot-melt adhesive compositions crosslinkable by moisture