Low temperature flexible die attach adhesive and articles using same

Application number :: 43884
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Low temperature flexible die attach adhesive and articles using same
Inventor :: Chien, Yuan Yung ; Nguyen, My Nhu
Agent name :
Address for service :
Filing date :: 25 May 1993
Associated companies :
Applicant name :: Johnson Matthey Inc.
Applicant address :
Old name :
Original Source :: Go

Low temperature flexible die attach adhesive and articles using same A Standard patent application filed on 25 May 1993 credited to Chien, Yuan Yung ; Nguyen, My Nhu