Three-dimensional multichip module systems and methods of fabrication
A Standard patent application filed on 26 March 1992 credited to Eichelberger, Charles W

Details

Application number :

17678  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Three-dimensional multichip module systems and methods of fabrication  

Inventor :

Eichelberger, Charles W  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

26 March 1992  

Associated companies :

 

Applicant name :

Integrated Systems Assemblies Corporation  

Applicant address :

600 West Cummings Park Wobourn MA 01801 United States Of America  

Old name :

 

Original Source :

Go  

Same Inventor

• Multichip integrated circuit module and method of fabrication