Etching method for obtaining at least one cavity in a substrate and substrate obtained by such method
A Standard patent application filed on 07 March 1991 credited to Van Lintel, Harald T. G.
Details
Application number :
74754
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Etching method for obtaining at least one cavity in a substrate and substrate obtained by such method