Packaging structure and method for packaging a semiconductor device
A Standard patent application filed on 22 January 1991 credited to Miki, Atsushi ; Nishiguchi, Masanori

Details

Application number :
69824  
Application type :
Standard  
Application status :
CEASED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Packaging structure and method for packaging a semiconductor device  
Inventor :
Miki, Atsushi ; Nishiguchi, Masanori  
Agent name :
Davies Collison Cave  
Address for service :
Level 15 1 Nicholson Street MELBOURNE VIC 3000  
Filing date :
22 January 1991  
Associated companies :
 
Applicant name :
Sumitomo Electric Industries, Ltd.  
Applicant address :
5-33 Kitahama 4-chome Chuo-ku Osaka Japan  
Old name :
 
Original Source :
Go  

Same Inventor