Hot melt material application system with high temperature pressure monitoring and heated recirculating manifolds
A Standard patent application filed on 29 October 1999 credited to Roos, John P. ; Loparo, Thomas A. ; Palmer, William L. ; Dillon, John C. ; Stewart, Stephen P. ; Nagy, Charles F. ; Borders, Lenzie L. ; Waryu, Joseph C.

Details

Application number :

13332  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Hot melt material application system with high temperature pressure monitoring and heated recirculating manifolds  

Inventor :

Roos, John P. ; Loparo, Thomas A. ; Palmer, William L. ; Dillon, John C. ; Stewart, Stephen P. ; Nagy, Charles F. ; Borders, Lenzie L. ; Waryu, Joseph C.  

Agent name :

 

Address for service :

 

Filing date :

29 October 1999  

Associated companies :

 

Applicant name :

Nordson Corporation  

Applicant address :

 

Old name :

 

Original Source :

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