High fidelity thermostable ligase and uses thereof
A Standard patent application filed on 29 October 1999 credited to Barany, Francis ; Tong, Jie ; Cao, Weiguo

Details

Application number :

13310  

Application type :

Standard  

Application status :

SEALED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High fidelity thermostable ligase and uses thereof  

Inventor :

Barany, Francis ; Tong, Jie ; Cao, Weiguo  

Agent name :

PHILLIPS ORMONDE FITZPATRICK  

Address for service :

367 Collins Street MELBOURNE VIC 3000  

Filing date :

29 October 1999  

Associated companies :

 

Applicant name :

Cornell Research Foundation Inc.  

Applicant address :

Suite 105 20 Thornwood Drive Ithaca NY 14850 United States Of America  

Old name :

 

Original Source :

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