Molded implants for orthopedic applications
A Standard patent application filed on 14 March 2000 credited to Wironen, John F.
;
Kao, Penelope
;
Horn, Jeffrey
Details
Application number :
64067
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Molded implants for orthopedic applications
Inventor :
Wironen, John F.
;
Kao, Penelope
;
Horn, Jeffrey
Agent name :
SPRUSON & FERGUSON
Address for service :
GPO Box 3898 SYDNEY NSW 2001
Filing date :
14 March 2000
Associated companies :
Applicant name :
Regeneration Technologies, Inc.
Applicant address :
1 Innovation Drive Alachua FL 32615 United States Of America