Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer
A Standard patent application filed on 28 November 1989 credited to Homma, Michihide
;
Isayama, Katsuhiko
;
Wakabayashi, Hiroshi
;
Yoshihara, Atsuko
Details
Application number :
45622
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer