Details
- Application number :
- 13175
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Method of modifying a surface of a structured wafer
- Inventor :
- Pendergrass, Daniel B. Jr.
- Agent name :
-
- Address for service :
-
- Filing date :
- 18 October 1999
- Associated companies :
-
- Applicant name :
- 3M Innovative Properties Company
- Applicant address :
-
- Old name :
-
- Original Source :
- Go