Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition
A Standard patent application filed on 12 September 1989 credited to Chao, Yen-Yau Harrison
;
Will, Albert Steven
;
Smart, Reginald T.
Details
Application number :
41282
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition
Inventor :
Chao, Yen-Yau Harrison
;
Will, Albert Steven
;
Smart, Reginald T.
Agent name :
Davies Collison Cave
Address for service :
Level 15 1 Nicholson Street MELBOURNE VIC 3000
Filing date :
12 September 1989
Associated companies :
Applicant name :
Rohm and Haas Company
Applicant address :
Independence Mall West, Philadelphia Pennsylvania 19105 U.S.A.