Creping device adhesive formulation
A Standard patent application filed on 01 June 1989 credited to Chen, Patrick P.
;
Skerret, J. Richard
;
Chiu, Taiwoo
Details
Application number :
35895
Application type :
Standard
Application status :
EXPIRED
Under opposition :
No
Proceeding type :
Invention title :
Creping device adhesive formulation
Inventor :
Chen, Patrick P.
;
Skerret, J. Richard
;
Chiu, Taiwoo
Agent name :
Callinans
Address for service :
PO Box 1189 HARTWELL VIC 3124
Filing date :
01 June 1989
Associated companies :
Applicant name :
Kimberly-Clark Worldwide, Inc.
Applicant address :
401 North Lake Street Neenah WI 54957-0349 United States Of America