Epoxy resin compositions for use in low temperature curing applications
A Standard patent application filed on 21 October 1988 credited to Puckett, Paul M.
;
Wykowski, Paul L.
Details
Application number :
27150
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Epoxy resin compositions for use in low temperature curing applications
Inventor :
Puckett, Paul M.
;
Wykowski, Paul L.
Agent name :
PHILLIPS ORMONDE FITZPATRICK
Address for service :
367 Collins Street MELBOURNE VIC 3000
Filing date :
21 October 1988
Associated companies :
Applicant name :
Dow Chemical Company, The
Applicant address :
2030 Dow Center Abbott Road Midland MI 48640 United States Of America