Improved mold structure for producing an encapsulated window assembly
A Standard patent application filed on 23 April 1987 credited to Gordon, Theodore Harry
;
Bartek, Werner Walter
Details
Application number :
71905
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Improved mold structure for producing an encapsulated window assembly
Inventor :
Gordon, Theodore Harry
;
Bartek, Werner Walter
Agent name :
PHILLIPS ORMONDE FITZPATRICK
Address for service :
367 Collins Street MELBOURNE VIC 3000
Filing date :
23 April 1987
Associated companies :
Applicant name :
Libbey-Owens-Ford Company
Applicant address :
811 Madison Avenue, Toledo, Ohio, United States of America.