Semiconductor package clad material and semiconductor package using the same
A Standard patent application filed on 23 June 2000 credited to Saijo, Kinji ; Ohsawa, Sinji ; Okamoto, Hiroaki ; Yoshida, Kazuo

Details

Application number :
54300  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Semiconductor package clad material and semiconductor package using the same  
Inventor :
Saijo, Kinji ; Ohsawa, Sinji ; Okamoto, Hiroaki ; Yoshida, Kazuo  
Agent name :
 
Address for service :
 
Filing date :
23 June 2000  
Associated companies :
 
Applicant name :
Toyo Kohan Co. Ltd.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor