Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
A Standard patent application filed on 25 October 1999 credited to Labunsky, Michael ; Huynh, Tac ; Travis, Glenn W. ; Nagengast, Andrew J. ; Meyer, Anthony

Details

Application number :

12244  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization  

Inventor :

Labunsky, Michael ; Huynh, Tac ; Travis, Glenn W. ; Nagengast, Andrew J. ; Meyer, Anthony  

Agent name :

 

Address for service :

 

Filing date :

25 October 1999  

Associated companies :

 

Applicant name :

Lam Research Corporation  

Applicant address :

 

Old name :

 

Original Source :

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