LIQUID-COOLING MODULE SYSTEM FOR ELECTRONIC COMPONENTS
A Standard patent application filed on 21 January 1985 credited to Yamamoto, Haruhiko ; Kikuchi, Shunich ; Katsuyama, Kouji ; Nakata, Mitsuhiko

Details

Application number :

37943  

Application type :

Standard  

Application status :

CEASED  

Under opposition :

No  

Proceeding type :

 

Invention title :

LIQUID-COOLING MODULE SYSTEM FOR ELECTRONIC COMPONENTS  

Inventor :

Yamamoto, Haruhiko ; Kikuchi, Shunich ; Katsuyama, Kouji ; Nakata, Mitsuhiko  

Agent name :

Davies Collison Cave  

Address for service :

Level 15 1 Nicholson Street MELBOURNE VIC 3000  

Filing date :

21 January 1985  

Associated companies :

 

Applicant name :

Fujitsu Limited  

Applicant address :

 

Old name :

 

Original Source :

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