Split via surface mount connector and related techniques
A Standard patent application filed on 05 June 2000 credited to Vallance, R. Ryan ; Kiani, Sepehr

Details

Application number :

53230  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Split via surface mount connector and related techniques  

Inventor :

Vallance, R. Ryan ; Kiani, Sepehr  

Agent name :

 

Address for service :

 

Filing date :

05 June 2000  

Associated companies :

 

Applicant name :

Teradyne, Inc.  

Applicant address :

 

Old name :

 

Original Source :

Go  

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