Deposited thin build-up layer dimensions as a method of relieving stress in highdensity interconnect printed wiring board substrates
A Standard patent application filed on 12 October 1999 credited to Strandberg, Jan I. ; Lykins, James L.

Details

Application number :

10997  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Deposited thin build-up layer dimensions as a method of relieving stress in highdensity interconnect printed wiring board substrates  

Inventor :

Strandberg, Jan I. ; Lykins, James L.  

Agent name :

 

Address for service :

 

Filing date :

12 October 1999  

Associated companies :

 

Applicant name :

Kulicke & Soffa Holdings, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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