Method for manufacturing a multilayer printed circuit board and composite foil for use therein
A Standard patent application filed on 23 March 2000 credited to Michel, Damien
;
Gales, Raymond
Details
Application number :
41083
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method for manufacturing a multilayer printed circuit board and composite foil for use therein