Method and apparatus for plating and polishing a semiconductor substrate
A Standard patent application filed on 29 March 2000 credited to Uzoh, Cyprian Emeka ; Talieh, Homayoun

Details

Application number :

39292  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for plating and polishing a semiconductor substrate  

Inventor :

Uzoh, Cyprian Emeka ; Talieh, Homayoun  

Agent name :

 

Address for service :

 

Filing date :

29 March 2000  

Associated companies :

 

Applicant name :

Nutool, Inc.  

Applicant address :

 

Old name :

 

Original Source :

Go  

Same Inventor

• Method and apparatus for depositing and controlling the texture of...
• Method and apparatus for simultaneously cleaning and annealing a...