Leak tight joint and method, and levelling polymer for providing a smooth surface on a concrete body being jointed
A Standard patent application filed on 26 April 2003 credited to Chua, Hui Tong ; Wang, Huimin ; Ng, Wun Jern ; Leung, Shin Cheung Carl ; Wee, Tiong Huan ; Phoon, Kok Kwang

Details

Application number :

2003299151  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Leak tight joint and method, and levelling polymer for providing a smooth surface on a concrete body being jointed  

Inventor :

Chua, Hui Tong ; Wang, Huimin ; Ng, Wun Jern ; Leung, Shin Cheung Carl ; Wee, Tiong Huan ; Phoon, Kok Kwang  

Agent name :

 

Address for service :

 

Filing date :

26 April 2003  

Associated companies :

 

Applicant name :

NATIONAL UNIVERSITY OF SINGAPORE  

Applicant address :

10 Kent Ridge Crescent, Singapore 119260  

Old name :

 

Original Source :

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