Metallic coated dielectric substrates comprising parylene polymer protective layer
A Standard patent application filed on 12 December 2003 credited to Saccomanno, Robert J.

Details

Application number :
2003297094  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Metallic coated dielectric substrates comprising parylene polymer protective layer  
Inventor :
Saccomanno, Robert J.  
Agent name :
 
Address for service :
 
Filing date :
12 December 2003  
Associated companies :
 
Applicant name :
HONEYWELL INTERNATIONAL INC.  
Applicant address :
101 Columbia Road, P.O. Box 2245, Morristown, NJ 07960  
Old name :
 
Original Source :
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Same Inventor