Printed circuit boards with solid interconnect and method of producing the same
A Standard patent application filed on 14 January 2000 credited to Chua, Ah Lim

Details

Application number :
36900  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Printed circuit boards with solid interconnect and method of producing the same  
Inventor :
Chua, Ah Lim  
Agent name :
 
Address for service :
 
Filing date :
14 January 2000  
Associated companies :
 
Applicant name :
Gul Technologies Singapore Ltd.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor