Method and apparatus for measuring thickness of a test object between two eddy current sensor heads
A Standard patent application filed on 12 December 2003 credited to Martner, Cecilia ; Miller, G. Laurie ; Huston, Joel ; Lei, Lawrence C. ; Gu, Yu Ping ; Pham, Quyen ; Lu, Siqing ; Chang, Yu ; Smith, Paul

Details

Application number :

2003293526  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for measuring thickness of a test object between two eddy current sensor heads  

Inventor :

Martner, Cecilia ; Miller, G. Laurie ; Huston, Joel ; Lei, Lawrence C. ; Gu, Yu Ping ; Pham, Quyen ; Lu, Siqing ; Chang, Yu ; Smith, Paul  

Agent name :

 

Address for service :

 

Filing date :

12 December 2003  

Associated companies :

 

Applicant name :

APPLIED MATERIALS, INC.  

Applicant address :

P.O. Box 450A, Santa Clara, CA 95052  

Old name :

 

Original Source :

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