A chucking system and method for modulating shapes of substrates
A Standard patent application filed on 12 November 2003 credited to Choi, Byung-Jin
;
Babbs, Daniel A.
;
Bailey, Hillman L.
;
Sreenivasan, Sidlgata V.
;
Watts, Michael P. C.
;
Schumaker, Norman E.
;
Voisin, Ronald D.
;
Meissl, Mario J.
Details
Application number :
2003291477
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
A chucking system and method for modulating shapes of substrates
Inventor :
Choi, Byung-Jin
;
Babbs, Daniel A.
;
Bailey, Hillman L.
;
Sreenivasan, Sidlgata V.
;
Watts, Michael P. C.
;
Schumaker, Norman E.
;
Voisin, Ronald D.
;
Meissl, Mario J.
Agent name :
Address for service :
Filing date :
12 November 2003
Associated companies :
Applicant name :
MOLECULAR IMPRINTS, INC.
Applicant address :
1807-C West Braker Lane, Suite 100, Austin, TX 78758-3605