Toughened epoxy/polyanhydride no- flow underfill encapsulant composition
A Standard patent application filed on 31 October 2003 credited to Shah, Jayesh P.

Details

Application number :

2003287428  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Toughened epoxy/polyanhydride no- flow underfill encapsulant composition  

Inventor :

Shah, Jayesh P.  

Agent name :

 

Address for service :

 

Filing date :

31 October 2003  

Associated companies :

 

Applicant name :

NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION  

Applicant address :

P.O. Box 7663, Wilmington, DE 19803-7663  

Old name :

 

Original Source :

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