Details
- Application number :
- 2003287087
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Fast moisture curing and uv-moisture dual curing compositions
- Inventor :
- Chu, Hsien-Kun
- Agent name :
-
- Address for service :
-
- Filing date :
- 15 October 2003
- Associated companies :
-
- Applicant name :
- Henkel Corporation
- Applicant address :
- 1001 Trout Brook Crossing
Rocky Hill, CT 06067
United States of America
- Old name :
-
- Original Source :
- Go