Polycarbonate-based resin composition for extrusion using sizing die and molded article
A Standard patent application filed on 26 September 2003 credited to Nakano, Hiroshi ; Ito, Hidetaka

Details

Application number :

2003273584  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polycarbonate-based resin composition for extrusion using sizing die and molded article  

Inventor :

Nakano, Hiroshi ; Ito, Hidetaka  

Agent name :

 

Address for service :

 

Filing date :

26 September 2003  

Associated companies :

 

Applicant name :

MITSUBISHI ENGINEERING-PLASTICS CORPORATION  

Applicant address :

1-1-1, Kyobashi, Chuo-ku, Tokyo 104-0031  

Old name :

 

Original Source :

Go