Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method
A Standard patent application filed on 24 September 2003 credited to Onari, Hiroyuki ; Yoshimoto, Kazuhiro ; Oshima, Yukio ; Nishio, Yoshitaka ; Okajima, Yasutomo

Details

Application number :

2003268668  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method  

Inventor :

Onari, Hiroyuki ; Yoshimoto, Kazuhiro ; Oshima, Yukio ; Nishio, Yoshitaka ; Okajima, Yasutomo  

Agent name :

 

Address for service :

 

Filing date :

24 September 2003  

Associated companies :

 

Applicant name :

MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.  

Applicant address :

2-12-12 Minami-Kaneden, Suita-city, Osaka 564-0044  

Old name :

 

Original Source :

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