Method of adhesion of conductive materials, laminate, and adhesive composition
A Standard patent application filed on 12 September 2003 credited to Sakamoto, Hiroyuki ; Morichika, Kazuo ; Kurosaki, Yoshinobu ; Kawanami, Toshitaka ; Saito, Takao

Details

Application number :

2003263595  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of adhesion of conductive materials, laminate, and adhesive composition  

Inventor :

Sakamoto, Hiroyuki ; Morichika, Kazuo ; Kurosaki, Yoshinobu ; Kawanami, Toshitaka ; Saito, Takao  

Agent name :

 

Address for service :

 

Filing date :

12 September 2003  

Associated companies :

 

Applicant name :

NIPPON PAINT CO., LTD.  

Applicant address :

1-2, Oyodokita 2-chome, Kita-ku, Osaka-shi, Osaka 531-8511  

Old name :

 

Original Source :

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Same Inventor

• Method of producing laminates, and laminates