Hydrosilation with platinum free neat copper containing catalyst
A Standard patent application filed on 05 September 2003 credited to Nguyen, Binh Thanh

Details

Application number :

2003263104  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Hydrosilation with platinum free neat copper containing catalyst  

Inventor :

Nguyen, Binh Thanh  

Agent name :

 

Address for service :

 

Filing date :

05 September 2003  

Associated companies :

 

Applicant name :

DOW CORNING CORPORATION  

Applicant address :

2200 West Salzburg Road, Midland, MI 48686-0994  

Old name :

 

Original Source :

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