Pressure contact spring for a contact arrangement in a power semiconductor module
A Standard patent application filed on 22 August 2003 credited to Assal, Jerome ; Herr, Egon

Details

Application number :

2003254681  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Pressure contact spring for a contact arrangement in a power semiconductor module  

Inventor :

Assal, Jerome ; Herr, Egon  

Agent name :

 

Address for service :

 

Filing date :

22 August 2003  

Associated companies :

 

Applicant name :

Abb Schweiz Ag  

Applicant address :

Brown Boveri Strasse 6, CH-5400 Baden  

Old name :

 

Original Source :

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