Method for manufacturing compound semiconductor wafer and compound semiconductor device
A Standard patent application filed on 01 August 2003 credited to Fukuhara, Noboru ; Yamada, Hisashi

Details

Application number :

2003252335  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method for manufacturing compound semiconductor wafer and compound semiconductor device  

Inventor :

Fukuhara, Noboru ; Yamada, Hisashi  

Agent name :

 

Address for service :

 

Filing date :

01 August 2003  

Associated companies :

 

Applicant name :

SUMITOMO CHEMICAL COMPANY, LIMITED  

Applicant address :

5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 541-8550  

Old name :

 

Original Source :

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