Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device
A Standard patent application filed on 30 May 2003 credited to Mizushima, Etsuo ; Kuriya, Hiroyuki ; Otsuka, Kazuhisa ; Yamamoto, Kazunori ; Kondou, Yuusuke ; Yamaguchi, Masanori ; Shimada, Yasushi ; Hirata, Yoshitaka ; Shimayama, Yuichi ; Madarame, Ken

Details

Application number :

2003242008  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device  

Inventor :

Mizushima, Etsuo ; Kuriya, Hiroyuki ; Otsuka, Kazuhisa ; Yamamoto, Kazunori ; Kondou, Yuusuke ; Yamaguchi, Masanori ; Shimada, Yasushi ; Hirata, Yoshitaka ; Shimayama, Yuichi ; Madarame, Ken  

Agent name :

 

Address for service :

 

Filing date :

30 May 2003  

Associated companies :

 

Applicant name :

HITACHI CHEMICAL CO., LTD.  

Applicant address :

1-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0449  

Old name :

 

Original Source :

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