Details
- Application number :
- 2003237768
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- An integrated circuit package employing a flexible substrate
- Inventor :
- Fernandez, Elstan Anthony
- Agent name :
-
- Address for service :
-
- Filing date :
- 28 May 2003
- Associated companies :
-
- Applicant name :
- INFINEON TECHNOLOGIES AG
- Applicant address :
- St.-Martin-Srasse 53, D-81699 Munich
- Old name :
-
- Original Source :
- Go