Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine
A Standard patent application filed on 13 May 2003 credited to Mashimo, Ikuo ; Tsuchiya, Masato ; Saito, Koichi

Details

Application number :

2003235243  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Wafer demounting method, wafer demounting device, and wafer demounting and transferring machine  

Inventor :

Mashimo, Ikuo ; Tsuchiya, Masato ; Saito, Koichi  

Agent name :

 

Address for service :

 

Filing date :

13 May 2003  

Associated companies :

 

Applicant name :

MIMASU SEMICONDUCTOR INDUSTRY CO., LTD.  

Applicant address :

762, Ashikado, Gunma-machi, Gunma-gun, Gunma 370-3531  

Old name :

 

Original Source :

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