Improved platen for electrostatic wafer clamping apparatus
A Standard patent application filed on 30 April 2003 credited to Williams, Bruce T. ; Matsubara, Hideaki ; Yanagida, Hiroaki ; Okuhara, Yoshiki ; Aoki, Shoji ; Uehara, Toshio ; Kawashima, Naoki

Details

Application number :

2003228776  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Improved platen for electrostatic wafer clamping apparatus  

Inventor :

Williams, Bruce T. ; Matsubara, Hideaki ; Yanagida, Hiroaki ; Okuhara, Yoshiki ; Aoki, Shoji ; Uehara, Toshio ; Kawashima, Naoki  

Agent name :

 

Address for service :

 

Filing date :

30 April 2003  

Associated companies :

 

Applicant name :

TREK, INC.  

Applicant address :

11601 Maple Ridge Road, Medina, NY 14103  

Old name :

 

Original Source :

Go