Low loss dielectric material for printed circuit boards and integrated circuit chip packaging
A Standard patent application filed on 25 April 2003 credited to Zahr, George Elias ; Lin, Pui-Yan ; Rajendran, Govindasamy Paramasivan

Details

Application number :

2003225163  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Low loss dielectric material for printed circuit boards and integrated circuit chip packaging  

Inventor :

Zahr, George Elias ; Lin, Pui-Yan ; Rajendran, Govindasamy Paramasivan  

Agent name :

 

Address for service :

 

Filing date :

25 April 2003  

Associated companies :

 

Applicant name :

E.I. DU PONT DE NEMOURS AND COMPANY  

Applicant address :

1007 Market Street, Wilmington, DE 19898  

Old name :

 

Original Source :

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