Solder compositions for attaching a die to a substrate
A Standard patent application filed on 23 April 2003 credited to Besser, Brant ; Carroll-Shearer, Lori D. ; Strouse, Floyd

Details

Application number :

2003225119  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Solder compositions for attaching a die to a substrate  

Inventor :

Besser, Brant ; Carroll-Shearer, Lori D. ; Strouse, Floyd  

Agent name :

 

Address for service :

 

Filing date :

23 April 2003  

Associated companies :

 

Applicant name :

FREESCALE SEMICONDUCTOR, INC.  

Applicant address :

6501 William Cannon Drive West, Austin, TX 78735, USA  

Old name :

 

Original Source :

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