Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs
A Standard patent application filed on 17 April 2003 credited to Askew, Charles
;
Verdielli, Jean-Marc
;
Bennett, Jeffrey
;
Yao, Xiaowei
;
Finot, Marc
;
Lake, Rickie C.
;
Kohler, Robert
;
Epitaux, Marc
Details
Application number :
2003221750
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs
Inventor :
Askew, Charles
;
Verdielli, Jean-Marc
;
Bennett, Jeffrey
;
Yao, Xiaowei
;
Finot, Marc
;
Lake, Rickie C.
;
Kohler, Robert
;
Epitaux, Marc
Agent name :
Address for service :
Filing date :
17 April 2003
Associated companies :
Applicant name :
INTEL CORPORATION
Applicant address :
2200 Mission College Boulevard, Santa Clara, CA 95052