Resin composition and multi-layer structures
A Standard patent application filed on 20 February 2003 credited to Masuda, Haruhisa ; Ikeda, Kaoru ; Watanabe, Tomoyuki ; Tai, Shinji ; Isoyama, Kouta

Details

Application number :

2003211340  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Resin composition and multi-layer structures  

Inventor :

Masuda, Haruhisa ; Ikeda, Kaoru ; Watanabe, Tomoyuki ; Tai, Shinji ; Isoyama, Kouta  

Agent name :

 

Address for service :

 

Filing date :

20 February 2003  

Associated companies :

 

Applicant name :

KURARAY CO., LTD.  

Applicant address :

1621, Sakazu, Kurashiki-shi, Okayama 710-8622  

Old name :

 

Original Source :

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