Solder paste formulations, methods of production and uses thereof
A Standard patent application filed on 12 February 2003 credited to Lalena, John ; Weiser, Martin ; Le, Kim-Chi

Details

Application number :

2003211032  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Solder paste formulations, methods of production and uses thereof  

Inventor :

Lalena, John ; Weiser, Martin ; Le, Kim-Chi  

Agent name :

 

Address for service :

 

Filing date :

12 February 2003  

Associated companies :

 

Applicant name :

HONEYWELL INTERNATIONAL INC.  

Applicant address :

P.O. Box 2245, 101 Columbia Road, Morristown, NJ 07962  

Old name :

 

Original Source :

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