Volatile copper(ii) complexes for deposition of copper films by atomic layer deposition
A Standard patent application filed on 21 January 2003 credited to Bradley, Alexander Zak ; Thompson, Jeffery Scott ; Thorn, David Lincoln

Details

Application number :

2003210599  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Volatile copper(ii) complexes for deposition of copper films by atomic layer deposition  

Inventor :

Bradley, Alexander Zak ; Thompson, Jeffery Scott ; Thorn, David Lincoln  

Agent name :

 

Address for service :

 

Filing date :

21 January 2003  

Associated companies :

 

Applicant name :

E.I. DU PONT DE NEMOURS AND COMPANY  

Applicant address :

1007 Market Street, Wilmington, DE 19898  

Old name :

 

Original Source :

Go